Method for making MOSFET device having controlled parasitic isolation threshold voltage

ABSTRACT

A MOSFET has shallow trenches of a thick oxide for isolating the MOSFET device from a surrounding substrate. The MOSFET has a gate wiring layer that includes co-aligned metallurgy of a predetermined work function at regions where the gate wiring layer passes over the oxide of the isolation trenches. The co-aligned metallurgy of predetermined work function is operative to increase the parasitic threshold voltage associated with the MOSFET&#39;s parasitic leakage currents.

This application is a division of application Ser. No. 08/366,517 filedDec. 30, 1994 which application is now U.S. Pat. No. 5,650,654.

TECHNICAL FIELD

This invention relates to a MOSFET (Metal On Silicon Field EffectTransistor). More particularly, the present invention relates tocontrolling the parasitic threshold voltage characteristics of a MOSFET.

BACKGROUND ART

A MOSFET has a gate region for controlling a flow of charge between asource and drain of the FET in accordance with the gate to sourcevoltage of the FET. When a voltage is applied to the gate of a MOSFETtransistor, hereinafter FET, the voltage induces first a depletionregion within semiconductor material beneath a gate oxide region andthen finally a channel of an appropriate carrier for allowing a flow ofcharge between the drain and the source of the FET.

For a FET having trench isolation regions surrounding an active regionthereof, gate metallization extends over an oxide of the isolationregion on a first side of the gate and overhangs the gate on an oppositeside by a slight amount. The portions of the gate metallization thatextend over the isolation regions create residual fields within theoxide of the trench isolation regions. The residual fields are directedtoward walls of the semiconductor substrate associated with the activeregion of the FET and to the substrate floors of the trench isolationregions. These fields, if of sufficient magnitude, create carrierchannels in the walls of the active region of the semiconductorsubstrate and in the substrate floors beneath the isolation regions forallowing parasitic leakage currents to flow in the walls of the activeregion and in the floor beneath the isolation regions in parallel withthe current flowing in the main channel on top of the active region.What is desired, therefore, is a way of controlling the parasiticvoltage threshold associated with generating these parasitic leakagecurrents.

DISCLOSURE OF INVENTION

It is an object of the present invention to provide an improved MOSFET.

It is another object of the present invention to provide an improvedMOSFET having a controlled parasitic voltage threshold.

It is another object of the present invention to provide a MOSFETwherein the parasitic voltage threshold is greater than the main voltagethreshold of the MOSFET.

In furtherance of these objectives, the present invention provides atrench isolated FET having a wiring layer coupled to a gate active areaof the FET. Metallurgy of a predetermined work function relative thework function of the wiring layer resides intermediate the wiring layerand a thick oxide of the trench regions.

In accordance with another aspect of the present invention, the FET hasbeen heated such that the metallurgy and polysilicon of the wiring layerreact to form a silicide.

In accordance with another embodiment of the present invention, a methodis provided for forming a trench isolated FET transistor. Asemiconductor substrate has a FET active region isolated by trench oxideboundaries, and covered with an oxide and a nitride pad. A layer ofmetallurgy of predetermined work function is deposited over thesubstrate including the nitride pad and the shallow trench oxideboundaries. The deposited metallurgy is then planarized by a Chem-Mechanical polish until the nitride pad is exposed. Thereafter, thenitride pad is removed leaving a hole in the deposited metallurgyexposing the oxide at the active region of the FET. The exposed oxide isthen removed exposing the active region of the FET. An oxide film isthen re-grown over the exposed active region of the FET. Thereafterpolysilicon is deposited over the metallurgy and the oxide film asexposed through the hole of the metallurgy. The polysilicon is thenpatterned in accordance with a desired gate wiring pattern for providinga gate wiring layer including a gate portion of the active region of theFET. The metallurgy is then etched using the patterned polysilicon as anetching mask, thus leaving metallurgy intermediate the gate wiring layerfor regions over the oxide of the trenches.

In accordance with one aspect of this embodiment, another step ofheating is provided so that the metallurgy interacts with thepolysilicon gate wiring layer to form a silicide.

In accordance with another aspect of the present invention, spacers areformed at the sides of the nitride pad before depositing the layer ofmetallurgy so as to prevent the metallurgy from contacting the activeregion of the FET.

BRIEF DESCRIPTION OF DRAWINGS

The foregoing and other objects, features and advantages of theinvention will be apparent from the following more particulardescription of preferred embodiments of the invention as illustrated inthe accompanying drawings in which:

FIG. 1 is a plan view of a FET in accordance with the present inventionillustrating trench isolation regions and an active region of the FET;

FIG. 2 is a cross-sectional view of the FET of FIG. 1 showing placementof metallurgy of predetermined work function;

FIGS. 3a-3m are cross sectional views illustrating the processing stepsassociated with fabricating a FET in accordance with the presentinvention; and

FIG. 4 is a cross sectional view of a prior art FET showing stray fieldsof gate metallization forming parasitic side wall channels in the FET'sactive region.

BEST MODE FOR CARRYING OUT THE INVENTION

For controlling threshold voltage characteristics, a metal of high workfunction is provided intermediate gate metallization and isolationregions of a shallow trench isolated MOSFET.

A shallow trench isolated FET transistor is illustrated in FIG. 1wherein gate metallization 16 extends from left to right over a gate ofthe FET and openings are established for drain and source contacts ofthe FET transistor. The drain 20, source 22 and gate 24 are parts of anactive region 12 of the FET transistor. The active region 12 issurrounded by shallow isolation trenches filled with oxide 14. Activeregion 12 thus appears as an island plateau surrounded by oxide 14 ofthe shallow trenches.

A cross-section of the FET transistor is illustrated in FIG. 2. Gatemetallization 16 extends over oxide 14 of a first shallow trench, overgate oxide 26', and partially over oxide 14 of a second shallow trench.In the present invention, a metal of predetermined work function 18 isprovided intermediate the gate metallization 16 and the oxide regions 14of the shallow trenches.

Work function W relates to the energy by which an electron is bound in agiven metal; conversely, work function W is the amount of energy whichis required of a photon to eject an electron from the given metal.Energy E of light is related to the frequency "v" of the light by theknown equation:

    E=hv                                                       Eq. 1

wherein h is Planck's constant. Therefore, the minimum frequency v_(o)of light required to eject an electron from a given metal can be relatedto the work function W of the given metal by the following equation.

    v.sub.o =W/h                                               Eq. 2

With reference to the cross-sectional view of FIG. 2, the source 22 (notshown) of the FET transistor would be located in active region 12 abovethe illustrated page whereas the drain 20 (not shown) of the FETtransistor would be located in the active region 12 beneath the page.The gate region 24 is shown in the cross-sectional view at active region12. As mentioned hereinbefore, when gate metallization 16 receives abias potential (with respect to substrate 12), a carrier channel isprovided just beneath gate oxide 26'.

A problem with the prior art topology is illustrated in FIG. 4 whereinstray fields 17 of gate metallization 16 orient themselves toward theside walls of the active region 12 of the semiconductor FET and to thesubstrate floor beneath oxide 14 of the isolation regions. The strayfields 17 oriented toward the side walls of the active region 12 causeparasitic carrier channels to form along the side walls in parallel withthe desired carrier channel on top of active region 12. The stray fields17 oriented toward the floors of the isolation regions cause parasiticchannels to form in the floors in parallel with the desired carrierchannel on top of action region 12. Thus, the parasitic fields 17 enableparasitic leakage currents to flow in parallel with the desired currentat the top of active region 12. The induced side and floor channels,i.e. edge and floor parasitics, typically have a distortion voltagethreshold characteristic within 300 mV of the main device voltagethreshold characteristics. By reducing the magnitude of the stray field17 within oxide region 14, the parasitic edge and floor effects canlikewise be reduced.

In accordance with the present invention, metallization 18 of high workfunction is provided intermediate gate metallization 16 and oxide 14 ofthe isolation regions. As mentioned hereinbefore, work function of agiven metal relates to the amount of energy required to eject anelectron from the given metal. With the high work functionmetallization, a higher gate voltage is required to overcome a metal tosilicon substrate work function difference φ_(ms) before inducing strayfields 17 within oxide 14 of the isolation regions. Thus, a greatervoltage is required to provide residual fields 17 strong enough forinducing parasitic channels in the side walls of active region 12 andthe floors of the isolation regions. In effect, the voltage threshold ofthe parasitic leakage currents has been increased by a magnitudecorresponding to the work function differential between the high workfunction metallization 18 and the original gate metallization 16 overthe isolation regions 14. Note that the ability to induce parasiticleakage currents in the side walls of the active region 12 and floors ofthe isolation regions is still present; however, the parasitic voltagethreshold characteristic has been shifted with respect to the mainvoltage threshold characteristic associated with creating a main channelon top of the plateau just beneath the gate oxide 26'. In the gate areaof the active region 12, there is an absence of metallization of highwork function and the characteristic threshold voltage is less than theparasitic threshold voltage associated with the regions of high workfunction metallization 18. Therefore, once a gate potential matching theparasitic voltage threshold is provided for generating induced currentsin the side walls of the plateau of active region 12 and the floors ofthe isolation regions, the magnitude of the main channel current justbeneath gate oxide 26' is sufficiently large to make the effects of theleakage currents negligible relative the main current.

In selecting the metal of high work function, the work function φ_(ms)for the metal should be greater than the work function of N+ polysiliconmaking up the gate wiring layer for NMOS devices; however, for PMOSdevices, it should be below that of P+ polysilicon making up the gatewiring layer. In a preferred embodiment of the present invention,Tungsten is used as the metallization of predetermined work function,for Tungsten has a work function intermediate N+ polysilicon and P+polysilicon. However, it should be apparent that other metals may beused in accordance with the design parameters of the specificapplication.

FIGS. 3a-3j illustrate the processing steps required for forming thestructure of the present invention. FIG. 3a shows the silicon substrate12 at its initial starting condition. In FIG. 3b, an oxide layer 26 anda nitride layer 28 are deposited over the substrate including an areaassociated with the active region of a FET. With reference to FIG. 3c,the nitride layer 28 and oxide layer 26 have been etched in accordancewith an appropriate etching mask to provide nitride pad 28 and oxide pad26 over the predetermined active area. Nitride pad 28 and oxide pad 26subsequently serve as etching blocks during etching of trenches withinthe semiconductor substrate 12 surrounding the FET active region. InFIG. 3d, the silicon of the semiconductor substrate 12 has been etchedaway to form isolation trenches. In this description, the semiconductorsubstrate is described as silicon; however, it should be apparent thatthe same principals can be applied for other semiconductor substratessuch as GaAs. Normally, the etching depth for the trenches is about 0.5micrometers. What is left after etching the trenches is an active regionplateau 12 with a gate stack of oxide pad 26 and nitride pad 28. Notethat the nitride 28 and oxide 26 are formed over the entire activeregion of the FET transistor, including drain 20, gate 24 and source 22areas of the FET. After etching away the shallow trenches for theisolation regions, a thermo-oxide is grown over the etched siliconsubstrate and an oxide deposition provided for filling the trenchregions. The oxide deposition also covers the gate stack as shown inFIG. 3e.

In FIG. 3f, a Chem-Mechanical polish has been provided for removing theoxide down to a height associated with the nitride pad. As known,Chem-Mechanical polishing employs selective slurries which havedifferent removal rates for substances with different etch rates forproviding co-planar etching. The techniques are described in U.S. Pat.No. 4,944,836 to Beyer et al., entitled "Chem-Mech Polishing Method forProducing Co-Planar Metal/Insulator Films on a Substrate," which ishereby incorporated by reference. Note that during the etching, theoxide is softer than the nitride pad so that a slight offset resultsbetween the top of nitride pad 28 and the top of the oxide 14 associatedwith the isolation regions. To further accentuate this offset, adifferential etch may be used after the chem-mechanical polishing so asto etch oxide 14 of the isolation trench regions and provide, as shownin FIG. 3g, a greater offset between the top of nitride pad 28 and thetop of the oxide 14 associated with the isolation regions.

Normally, etching tolerances are sufficient for assuring that the top ofoxide 14 has a height equal to or above the top of oxide layer 26 overthe active region of the FET. This assures that there is no exposure tothe silicon substrate of active region 12 which remains buried beneathoxide 26 and surrounded on appropriate sides by oxide 14. However,should the tolerancing not be sufficient for assuring or guaranteeingthat the active region remains buried and surrounded by oxide, then itwould be appropriate to provide spacers 30 on the sides of nitride pad28 before continuing processing. Thus, in FIG. 3h, the optional spacers30 are provided along the sides of nitride pad 28 to assure that thereis no exposure of active region 12.

In providing spacers 30, a nitride passivation film is first depositedconformally over the substrate. A nitride material is disclosed for thepassivation film, but another suitable material can be used if of astructure and function similar in kind to that of the nitride material.After depositing the passivation film, a directional reactive ion etch(RIE) is performed along a vertical axis perpendicular to the substratein order to etch a minimum thickness of the passivation film at planarregions thereof. As a result, passivation material remains alongsidevertical walls of the substrate surface. As shown in FIG. 3h,passivation material is left alongside the vertical walls of the gatestack structure.

Next, a deposition of metal of predetermined work function is providedover the substrate which buries nitride pad 28. The metal 32 ofpredetermined work function conforms to the upper surface profile of thesemiconductor substrate. Typically, the metal of predetermined workfunction is deposited with a depth of 100 angstroms to 1,000 angstroms.In the present invention, tungsten is used as the metal of predeterminedwork function because it has a work function intermediate N+ polysiliconand P+ polysilicon, the gate wiring layers of N channel and P channelMOSFET devices respectively. However, as mentioned hereinbefore, metalsof other work function can be used in accordance with the work functiondifferential needed for obtaining a desired parasitic voltage threshold.The metal must also have the appropriate refractory properties in orderto withstand thermal cycles of subsequent processing steps.

It is known that the voltage threshold for a FET transistor is directlyproportional to the work function differential between the FET's gatemetallization and substrate, i.e. φ_(ms). Therefore, a work functionmetal 32 is selected for providing the desired φ_(ms) to effect thedesired voltage threshold characteristic. Equation 1 shows therelationship between voltage threshold V_(t) and the work functionpotential difference φ_(ms). ##EQU1##

φ_(ms) is equal to the work function difference that exists between thegate metallization and the substrate material (i.e. silicon). φ_(f) isequal to the Fermi level of the substrate material. Q_(b) is equal tothe charge stored in the depletion region, whereas C_(0X) is equal tothe gate oxide capacitance per unit area, and Q_(SS) is equal to thecharge density in the oxide at the silicon interface. Thus, it isapparent that the voltage threshold V_(t) is directly proportional tothe work function potential difference φ_(ms) between the gatemetallization and the substrate material.

After depositing the metal 32 of predetermined work function over thesemiconductor substrate, a Chem-Mechanical polish is used to etch downthe structure in a planarized fashion. This results in the formation asshown in FIG. 3j wherein the metal of predetermined work function 18,i.e. Tungsten, surrounds nitride pad 28 and spacers 30 over activeregion 12.

Next, with reference to FIG. 3k, nitride pad 28, spacers 30 and oxidepad 26 are removed leaving silicon of the substrate exposed in anopening of Tungsten 18. The nitride 28 and oxide 26 are removed by, forexample, selective wet etchings of phosphoric and hydrofluoric etchingbaths respectively, which etch the nitride and oxide while leaving themetal 18 alone.

As shown in FIG. 31, a gate oxide layer 26' is regrown over activeregion 12. After growing the oxide over active region 12, a polysiliconmaterial 16 is deposited over the semi-conductor substrate. Next, thepolysilicon material is patterned in accordance with the desired gatewiring pattern. At this point, the polysilicon of the gate wiring layeris surrounded by (Tungsten) metallization 18 with windows (not shown)opening to the oxide layer over the drain and source areas of activeregion 12. Next, metallization 18 is etched as exposed using the patternof the polysilicon gate wiring layer 16 as a mask. What is left,therefore, with reference to FIG. 3m is the polysilicon gate wiringlayer 16 co-aligned with metallization 18 of predetermined work functionover regions associated with isolation trenches 14.

At this point, normal FET processing is resumed for providing diffusionsto the drain and source areas of the active region and thereafterproviding metallization contacts to the source and drain of the FET.During this subsequent processing, the temperature, in one aspect of thepresent invention, reaches a temperature sufficient to cause thepolysilicon of the gate wiring layer to react with the metallization ofpredetermined work function to form a silicide. This silicide isbelieved to be more stable wherein migration of the metal ofpredetermined work function is reduced.

Assuming an NMOS device has been formed, a voltage threshold associatedwith a main channel over the active region of the FET is proportional tothe work function difference φ_(ms) between the N+ polysilicon gatewiring layer 16 and silicon substrate 12. In contrast, the voltagethreshold associated with the parasitic channels in the side walls ofthe active region (adjacent the isolation trench regions) and floors ofthe isolation regions is proportional to the work function differenceφ_(ms) between Tungsten 18 and silicon substrate 12. By providing thedifferent threshold characteristics between the main channel and theparasitic channels, the parasitic effects may be made negligible withrespect to the main characteristics.

While the invention has been particularly shown and described withreference to preferred embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade therein without departing from the spirit and scope of theinvention.

I claim:
 1. A method of forming a trench isolated FET transistorcomprising the steps of:providing a semiconductor substrate with a FETactive region isolated by trench oxide boundaries, the FET active regionbeing covered with an oxide and a nitride pad; depositing a layer ofmetallurgy of predetermined work function over the substrate includingthe nitride pad and the trench oxide boundaries; planarizing thedeposited metallurgy until the nitride pad is exposed; removing thenitride pad and oxide over the FET active region leaving a hole in thedeposited metallurgy that exposes the semiconductor substrate at the FETactive region; forming an oxide film over the FET active region of thesemiconductor substrate; depositing polysilicon over the metallurgy ofpredetermined work function and the oxide film exposed through said holeof the metallurgy; patterning said polysilicon in accordance with adesired gate wiring pattern so as to provide a gate wiring layerincluding a gate region of the FET active region; and etching themetallurgy in accordance with the gate wiring layer so as to leavemetallurgy intermediate the gate wiring layer and the oxide of thetrench oxide boundaries, whereby the gate wiring layer has a directinterface with the oxide film over the gate region of the FET activeregion.
 2. A method according to claim 1, wherein the metallurgydeposited has a work function greater than the subsequently depositedpolysilicon.
 3. A method according to claim 1, wherein the metallurgydeposited has a work function less than the subsequently depositedpolysilicon.
 4. A method according to claim 1, wherein said metallurgyis Tungsten.
 5. A method according to claim 1, further comprising thestep of heating so that said metallurgy interacts with the polysiliconof the gate wiring layer to form a silicide.
 6. A method according toclaim 1, further comprising the step of forming spacers at sides of thenitride pad before depositing said metallurgy so as to prevent saidmetallurgy from contacting the FET active region when deposited.
 7. Amethod according to claim 1, wherein said step of planarizing comprisesChem-Mechanical polishing.
 8. A method according to claim 1, whereinsaid trench oxide boundary provided is a shallow trench oxide boundary.